one-stop PCB assembly for different application/OEM production

Item

Mass processing capability

Small batch processing capability

Layer (Max.)

2-12

24-28

Type of the board material

FR-4, high-TG , aluminum base, Rogers, etc., F4, BT

PTFE,PPO ,PPE ,

Rogers,etc

E-65,ect

Compound pressed board

4 layers 6 layers

6 layers 8 layers(FR-4+Rogers)

Maximum Size

400mm X 700mm

500mm X 1000mm  

Outline Size Tolerance

±0.13mm

±0.10mm

V-CUT Deepness Tolerance

+/- 0.15 mm (V-CUT) : +/- 0.1 mm (CNC V-CUT)

BoardThicknessRange

0.1mm6.0mm

7.08.0mm

Board Thickness Tolerance( t≥0.8mm)

±8%

±5%

Board Thickness Tolerance (t<0.8mm)

±10%

±8%

Medium Thickness(Min)

0.065mm(RCC)

0.05mm

Minimum Line Width

0.075mm(3mil)

0.063mm(2.5mil)

Minimum Line Distance

0.075mm(3mil)

0.063mm(2.5mil)

Line Margin

0.2 mm(CNC) : 0.30 mm (punch): .50 mm (V-CUT)

Outer layer copper thickness

9um140um

175um210um

Inner layer copper thickness

9um140um

175um210um

Drill hole size (mechanical hole)

0.25mm6.00mm

0.15mm0.25mm

Finish Hole size(mechanical hole)

0.10mm6.00mm

0.05mm0.1mm

Hole size tolerance (mechanical hole)

+/- 0.076 mm (normal hole) +/- 0.05 mm (fit-press hole) +0.1/-0.05 mm (punch hole)

Hole position deviation(mechanical hole)

+/-0.075mm: (drill hole) : +/- 0.10 mm (punch hole)

0.050mm

Laser hole size

0.10mm (1+n+12+n+2)

0.075mm

Aspect Ratio

10:1 (drill hole size>0.2mm)

12:1(drill hole size>0.25mm)

Solder mask type

sensitive green, yellow, black, MATT, blue, red ink,and peelable blue glue.

Minimum width of solder mask bridge

0.10mm

0.075mm

Minimum size of solder mask separation ring

0.05mm

0.025mm

Soldermask oil  plug hole diameter

0.25mm0.60mm

0.6mm-0.70mm

Impedance tolerance

±10% (impedance>50ohm)±5ohm(impedance<50ohm)

±5%  (impedance>50ohm)

Surface processing type

HAL, plating nickel gold(soft gold/flash gold), thick & hard gold, chemical nickel gold,  immersion tin, lead-free H.A.S.L, Entek ,gold-finger,and selective surface processing.